Molex, a global leader in complete interconnect solutions, has introduced the HS Stac™ connector—a modular and stackable design that combines the high-speed USCAR-30 HSAutolink™ interface with the versatility of the Stac64™ system. This innovative connector uses a 0.80mm pitch to offer greater flexibility and space efficiency for PCB layouts, making it ideal for in-vehicle infotainment and telematics systems.
The HS Stac connector is designed to meet the growing demand for high-speed data transmission in automotive applications. It supports USB 2.0, LVDS, and Ethernet, enabling seamless integration into infotainment, navigation, and driver assistance systems. The right-angle version of the connector features a rugged, stackable design that is compatible with the widely used Stac64â„¢ system, allowing for easy and efficient installation.
Laurent Stickeir, Global Product Manager at Molex, stated, “As in-vehicle functionality expands, so do the demands on device connectivity. With the HS Stac connector, customers who use or plan to use the Stac64 system can now create customized multi-bay assemblies that combine I/O and high-speed signals without the need for costly mold investments. This not only reduces costs and simplifies assembly but also provides more design flexibility and space savings.â€
Beyond the automotive sector, Molex leverages its expertise in high-speed data transmission from telecommunications and consumer electronics markets. The company has been actively involved in defining and promoting the USCAR-30 standard, which is an open, reliable connection system that meets both mechanical and environmental requirements of the automotive industry. Molex ensures superior electrical performance through rigorous testing and verification processes.
This new solution is aimed at meeting the increasing needs of automotive and commercial transportation applications, offering a scalable and future-proof approach to connectivity. Whether for car manufacturers or module developers, the HS Stac connector represents a significant step forward in achieving high-performance, compact, and cost-effective in-vehicle systems.
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