Since the beginning of this year, many packaging factories have begun to vigorously expand the flip-chip COB. At the same time, from the performance of accessories such as glue and substrate, they have also taken the products that are suitable for flip-chip COB as the key target.
"Since the second half of last year, we have introduced a number of high-efficiency, ultra-low thermal resistance flip-chip LED integrated light sources, and they will also become an important market direction for Xuyu in 2016." Lin Yu, Chairman of Xuyu Optoelectronics disclose.
According to Lin Jin's introduction, with the gradual increase in the current market demand for flip-chip light sources, it is expected that Xuyu will officially expand to 10 production lines next month.
In addition, the packaged factory Hongli Optoelectronics launched a new flip-chip COB, the index is >95, the power can cover 15-80w; Dehao Runda ceramic-based inverted COB, Ra=95, luminous efficiency up to 100lm/W; the same side Photoelectric high-density ceramic flip-chip cob, and the superconducting aluminum substrate COB light source of flip-chip solderless gold-free packaging technology introduced by Liyang Optoelectronics.
"The current COB light source technology is more and more mature, and the market has a stronger demand for COB light source. The packaging manufacturers no longer stay in the initial technical solution stage, and turn to the cost-effective stage of pursuing high-quality, high-efficiency COB, with high performance and high performance. The quality of the flip-chip welding gold-free packaging technology has also become a new direction of COB light source." Wang Liyang, marketing director of Hongli Optoelectronics said.
It is reported that there are two main types of flip-chip COB devices on the market: the first is a flip-chip CSP chip combined with a super-thermally conductive aluminum substrate or a ceramic substrate; the second is a flip-chip blue chip combined with a super-thermally conductive aluminum substrate or ceramic. Substrate. The former process is extremely simplified, the production efficiency is high, but the light color consistency is poor; while the latter has good light color consistency, the process is relatively mature, and easy to implement.
Since the beginning of this year, the related accessory manufacturers have also listed the inverted COB as the key promotion target. Taking Huigu Chemical, which focuses on medium and high-end glue in China, as an example, at the beginning of the new year, it will also be related to flip-chip COB, UV-LED and CSP. Auxiliary products, as the focus of this year's products, are enough to show the confidence of the accessories companies to treat this trend.
Overall, regardless of the trend of flip-chip COB, it is an effective means to solve the current decline in package gross profit and seek new profit growth points.
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