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Cypress Semiconductor announces a series of 1.3-megapixel image solutions in 1/4-inch optical format for direct replacement of existing 1/4-inch VGA image sensors in camera phones /4" VGA System-on-Chip (SoC) image sensor. These new low-cost imaging solutions enable mobile device manufacturers to upgrade their products with the same optical format and size, and deliver superior image quality at higher resolutions, reducing bill of materials Cost and cost of ownership.The CYIWOSC1300AA 1.3 megapixel image sensor and the CYIWCSC1300AA 1.3 megapixel SoC image sensor are the first camera phone image sensors produced specifically for image sensors using Cypress's advanced 0.13 micron CMOS process. These image sensors take full advantage of Cypress's high fill factor pixel architecture, which not only dramatically improves sensitivity without compromising image quality, but also eliminates the need for microlenses.
Luc De Mey, vice president of Cypress's Image Sensors business unit, stated, "We recognize that mobile device users are demanding higher image quality in increasingly smaller products. Our 1.3 megapixel image sensor solution is available in product size Providing an economical camera product with higher image quality and higher resolution while remaining unchanged can directly meet this demand."
Cypress's 1.3 megapixel image sensor uses a 1/4-inch optical format to achieve frame rates (fps) of 15 frames per second at full resolution and image windows of any size, and can be lower Power consumption maintains a smooth, continuous video preview. The sensor acts as the heart of the system, accepting commands from the two-wire serial interface, and providing Bayer arrayed RGB images or video streams through a 10-bit parallel data interface.
The 1.3 megapixel System-on-Chip (SoC) image sensor is a SXGA 1/4-inch format camera that delivers high-quality color still images even at very low brightness. High-performance camera phone applications and high-volume, low-cost applications require CMOS image technology that delivers high-quality CCD-quality image performance, as well as CMOS's high integration, ease of design, low cost, and low power consumption, while 1.3 million SoC is a combination of these excellent properties. SoC integrates the industry-leading image sensor core with an advanced on-chip image signal processor with numerous features including: defect interpolation, black level correction, lens deshaping, crosstalk compensation, and color mosaic patching ( Color mosaic interpolation), color correction, auto white balance with luminosity estimation, auto exposure and gain control, sharpening, noise reduction, effects, and gamma correction.
The new device will further expand the Cypress image sensor product line and is a good complement to Cypress's many products for the mobile phone market, including pseudo SRAM, dual-port memory, timing chips, and support for hard disk phones. USB controllers, as well as CapSense (Technology's PSoC (mixed-signal arrays) - enable capacitive touch sensing applications such as volume and backlight control.
Both the image sensor and the SoC use 2.8 (2.8 micron pixel size, and 1280 (1024 active pixel image array format. Both devices provide progressive scan and electronic scroll shutter).
Pricing and Availability Cypress is currently sampling the CYIWOSC1300AA, which is expected to be in volume production in December 2005. Samples of the CYIWCSC1300AA are scheduled to begin in the fourth quarter of 2005 and are expected to be commissioned in the second quarter of 2006. When ordering in bulk, it is expected that the unit price of the two devices will be less than $3. To view high-resolution photos and product specifications for these devices, visit
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